This invention describes a uniquely engineered 2-D amorphous carbon film and a memristor fabricated with coal-derived carbon quantum dots as the dielectric (switching) media for resistive random-access memory (RRAM). The atomic dielectric carbon layer can provide large storage density and 3-D packing ability, allowing memory and logic devices to be integrated in one chip, providing faster data processing with low energy consumption. This patent application is jointly owned by NETL and the University of Illinois-Urbana Champaign (UIUC) and it is available for licensing and/or further collaboration.
Challenge
Memory is essential to future computing with the exponential growth of data. These emerging memory technologies aim to revolutionize the existing memory hierarchy. Various emerging memory technologies are actively being investigated to meet ideal performance characteristics. RRAM has various advantages such as easy fabrication, simple metal-insulator-metal structure, excellent scalability, nanosecond speed, and long data retention. RRAM has been commercialized since 2013. Despite showing great promise over conventional RAM and its popularity in academia, RRAM has not become commercially popular. This is due to high device variability and high operation voltage.